We had a great conference in 2017 and are planning an even better one for April 24-26, 2018 at the Paris Hotel in Las Vegas.
Make sure to join us in Las Vegas next April at MHI’s Congress & Expo, the industry’s premier networking event.
2018 MHI CONGRESS & EXPO
Make plans to join us for the MHI National Congress & Expo for Manufactured and Modular Housing (MHI Congress & Expo) on April 24-26 at the Paris Hotel in Las Vegas where you will obtain the knowledge and resources necessary to excel in today’s housing marketplace. You can choose from top quality educational programs and special events, network with the most successful professionals in the industry, and connect with other attendees from all facets of the manufactured and modular housing industry.
Leave Las Vegas with new business relationships to enhance your growth, innovative ideas that will make a meaningful difference for your business, energy from powerful general session speakers, and details on the latest and greatest technologies and products available for the industry.
Stay tuned for more details.
“…very good way to network with your peers in the industry…many of our customers and potential customers…”
Joe Stegmayer, CEO, Cavco Industries
“Certainly a good way to get educated on what is going on in the industry…”
Gary McDaniel, CEO, YES! Communities
“…what is showcased here this week is the comradery and the connection of bringing all aspects of the business together…”
Wade Lyall, Regional Vice President, Champion Homes
Become an Exhibitor
Become a Sponsor
MHI’s policy prohibits promotional/sales materials from being placed or handed out at its events unless you are an exhibitor or sponsor and your sponsorship specifically includes the benefit of displaying your materials.
Sponsors at all levels of sponsorship are eligible to provide materials for distribution in the attendee registration bags at MHI Congress & Expo. Additional fee applies. If you would like to take advantage of this opportunity, please contact Kaitlyn Palatucci to become a sponsor.